This book covers all aspects of physical vapor deposition (PVD) process technology, from the characterization and preparation of the substrate through deposition processing and film characterization, to post-deposition processing. The emphasis is on the aspects of the process flow that are critical to economical deposition of films that can meet the required performance specifications.

The Handbook of Physical Vapor Deposition (PVD) Processing also covers vacuum technology, the fundamentals of individual deposition processes, adhesion, cleaning, and other topics. The comprehensive glossary of terms used in surface engineering will prove valuable to students, workers new to the field, and readers not fully conversant in English.

From the Preface: “The motivation for writing this book was that there was no single source of information which covers all aspects of Physical Vapor Deposition (PVD) processing in a comprehensive manner. The properties of thin films deposited by PVD processes depend on a number of factors, and each must be considered when developing a reproducible process and obtaining a high product throughput and yield from the production line...”

Target Audience: All researchers, technologists, and students who are concerned with physical vapor deposition processing.

Table of Contents:

Introduction

Substrate ("Real") Surfaces and Surface Modification

The Low-Pressure Gas and Vacuum Processing Environment

The Low-Pressure Plasma Processing Environment

Vacuum Evaporation and Vacuum Deposition

Physical Sputtering and Sputter Deposition (Sputtering)

Arc Vapor Deposition

Ion Plating and Ion Beam Assisted Deposition

Atomistic Film Growth and Some Growth-Related Film Properties

Film Characterization and Some Basic Film Properties

Adhesion and Deadhesion

Cleaning

External Processing Environment

Appendix 1: Reference Material

Appendix 2: Transfer of Technology from R & D to Manufacturing

Glossary of Terms and Acronyms Used in Surface Engineering

Index