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Title: Handbook of Plasma Immersion Ion Implantation and Deposition
Handbook of Plasma Immersion Ion Implantation and Deposition
By: Andre Anders, ed.
ISBN: 978 0471 24698 5
Publisher: John Wiley & Sons
Copyright: 2000
Page Count: 760
Trim Size: 6 x 9
Format: Hardcover
Catalog #: 03506
Status: Normally in stock
List Price: $255.00
Our Price: $218.50
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Keywords associated with this title: Plasma Deposition and Polymerization
Thin Films

 

Handbook of Plasma Immersion Ion Implantation and Deposition is the first book to describe this family of plasma techniques (PIII&D). This process utilizes negative high-voltage pulses to form a conformal electric sheath between the substrate and the plasma. Ions within the sheath are accelerated by the sheath's electrical field, and are implanted into the substrate on impact. Along with other advantages, this circumvents the line-of-sight restriction inherent in conventional ion implantation.

 

From the Preface: “...The early PIII work used gaseous plasmas such as nitrogen plasmas. By extending PIII to condensable (metal or organometallic) plasmas and vapors, the field was expanded from pure ion implantation to thin-film deposition. As a consequence, the letter D for deposition was included in the acronym, now PIII&D...PIII&D in its various forms has [now] become a mature technology with first applications of industrial size. The time has come to consolidate [our knowledge] in a single monograph dedicated to this field...”

 

Target Audience: Academic and industrial scientists, engineers, and researchers interested in investigating or utilizing the capabilities of PIII&D.

 

Table of Contents:

 

Introduction

Fundamentals of Plasmas and Sheaths

Ion Implantation and Thin-Film Deposition

Fundamentals of Plasma Immersion Ion Implantation and Deposition

Materials Characterization and Testing Methods — A Brief Survey

Design of a PIII&D Processing Chamber

Plasma Sources

Pulser Technology

Health and Safety Issues Related to PIII&D

Nonsemiconductor Applications of PIII&D

Semiconductor Applications

Appendix A: Survey of PIII&D Intellectual Property

Appendix B: Constants and Formula

Appendix C: Frequently Used Acronyms

Index

 

Primary Topic: Materials Science
Related Topics: Interfacial Engineering and Surface Science
Polymer Surface Modification
Surface Characterization and Analysis
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