This revised and expanded edition traces the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition techniques and the development of highly specialized equipment to enable this deposition.

The second edition of the Handbook of Thin Film Deposition includes entirely new chapters on contamination and contamination control, which assume greater and greater importance as dimensions shrink to sub-micron levels. A new chapter on metrology explains the growth of sophisticated, automatic tools capable of mesauring thickness and spacing at sub-micron levels. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together all the physical vapor deposition techniques. Finally, two entirely new areas receive in-depth treatment: Chemical mechanical polishing, which helps maintain the degree of flatness required for modern microlithography; and new materials used for interconnect dielectric materials, specifically organic polyimide materials.

From the Foreword: “...[I]f the technology for integrated circuit manufacture as practiced today were named for the majority of the processing steps, the technology could probably be more accurately described as thin-film technology. Consistent with this change, the processing for the deposition and patterning of films has received major research and engineering emphasis over the last few decades...Today one can control both the electrical and mechanical properties while achieving uniform and reproducible films from a few atomic layers thick to several micrometers. The chemistry and physics of the films are becoming increasingly better understood, but as they are, the demands of the device designer become more stringent...This book takes a snapshot of the state of the art in various technologies relating to thin films...This is the forefront of science and process engineering with important bearing on many modern industries.”

Target Audience: Engineers, technicians, upper-level students, and other readers concerned with the manufacture of semiconductors and other products dependent on thin film deposition.

Table of Contents:

Recent Changes in the Semiconductor Industry

Deposition Technologies and Applications: Introduction and Overview

Silicon Epitaxy by Chemical Vapor Deposition

Chemical Vapor Deposition of Silicon Dioxide Films

Metal Organic Chemical Vapor Deposition: Technology and Equipment

Feature Scale Modeling

The Role of Metrology and Inspection in Semiconductor Processing

Contamination Control, Defect Detection, and Yield Enhancement in Gigabit Manufacturing

Sputtering and Sputter Deposition

Laser and Electron Beam Assisted Processing

Molecular Beam Epitaxy: Equipment and Practice

Ion Beam Deposition

Chemical Mechanical Polishing

Organic Dielectrics in Multilevel Metallization of Integrated Circuits

Performance, Processing, and Lithography Trends

Index