This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding and testing procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book also includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture are covered as well.

From the Preface: “...The rapid advancements that have been made during the past two decades in microelectronic devices and packaging have been the drivers for the major changes that have occurred in adhesive materials and processes. Polymer adhesives such as epoxies, silicones, cyanate esters, and polyimides have, to a large extent, replaced metallurgical and vitreous attachment methods...This book brings together the entire technology of adhesives for electronics...”

Target Audience: Electronics, design, process, manufacturing, quality assurance and reliability engineers; materials scientists; and polymer chemists concerned with microelectronics applications.

Table of Contents:

Introduction

Functions and Theory of Adhesives

Chemistry, Formulation, and Properties of Adhesives

Adhesive Bonding Processes

Applications

Reliability

Test and Inspection Methods

Appendix

Index