This book (the first in a series on materials and processes for electronic applications) bridges the gap between electronics manufacturing and the material science and polymer chemistry of coatings designed for such uses. It describes the traditional roles of coatings for moisture and environmental protection of printed circuit boards; investigates functional dielectric coatings; elucidates masking, cleaning, and surface preparation methods; reviews over 20 processes for the application and curing of coatings; and discusses OSHA, EPA, and other governmental regulations which have resulted in formulation and process changes.

From the Preface: “...Concurrently with changes in the economy and government policies, major advances occurred in microelectronics that dictated new applications for materials in general and coatings in particular. High-purity dielectric coatings were developed and used as interlayer dielectrics and as stress buffers at both the IC and multilayer interconnect substrate levels...Photoimageable coatings have also assumed prominence during this period...Processes for cleaning assemblies prior to coating, and processes for dispensing and curing the coatings, have had to be reassessed...Finally, a major effort has occurred in reformulating coatings to meet federal, state, and county regulations on emissions and toxicity...”

Target Audience: Electronics design engineers; polymer chemists; process, quality, and reliability engineers; materials scientists; and support staff in both the electronics and polymer coatings industries.

Table of Contents:

Functions and Requirements of Coatings for Electronic Applications

Chemistry and Properties of Polymer Coatings

Manufacturing Technology

Applications

Reliability Assurance and Testing

Test Methods

Specifications and Documents

Appendix

Index