This volume documents the proceedings of the Second International Symposium on Polyimides and Other High Temperature Polymers: Characterization and Applications, held in Newark, NJ, December 3-6, 2001. It contains 32 peer-reviewed papers addressing many aspects and new developments regarding these materials, which possess a variety of desirable attributes, making them an ideal choice for a variety of technologies, ranging from microelectronics to high temperature adhesives to membranes. This collection offers a wealth of information while presenting a broad stroke of current commentary on this technologically important field.

From the Preface: “...For quite some time there has been a brisk R&D activity in synthesizing new polyimides and/or in amerliorating/modifying the existing materials. All signals indicate that interest in polyimides and other high temperature polymers will continue unabated...”

Target Audience: Academic and industrial scientists and technologists, as well as upper-level students, interested in the fundamental or applied aspects of this topic.

Partial Table of Contents:

Synthesis, Properties and Bulk Characterization:

Poly(amic acid)s and Their Ionic Salt Solutions: Synthesis, Characterization and Stability Study

Synthesis and Characterization of New Organosoluble Poly(ehter imide)s Derived from Various Novel Bis(ether anhydride)s

Synthesis of Novel Polyimides from Dianhydrides with Flexible Side Chains

New Photoalignable Polyimides and their Ability to Control Liquid-Crystal Alignment

Proton Conducting Polyimides from Novel Sulfonated Diamines

Effect of Structure on the Thermal Behaviour of Bisitaconimide Resins

Synthesis of Aromatic Benzoxazole Polymers for High Tg, Low Dielectric Properties

Electrical Breakdown and Electrostatic Phenomena in Ultra-Thin Polyimide Langmuir—Blodgettt Films

Transport of Water in High Tg Polymers: A Comparison Between Interacting and Non-Interacting Systems

Surface Modification, Interfacial or Adhesion Aspects and Applications:

New Developments in the Adhesion Promotion of Electroless Ni or Cu Films to Polyimide Substrates

Surface Modification of Polyimide to Improve Its Adhesion to Deposited Copper Layer

Plasma Polymer Adhesion Promoters for Metal—Polymer Systems

RF Plasma Etching of a Polyimide Film with Oxygen Mixed with Nitrogen Trifluoride

Fabrication of Thin-Film Transistors on Polyimide Films

Polyimide/Polystyrene Nanocomposite Films as Membranes for Gas Separation and Precursors for Polyimide Nanofoams

Influence of Aramid Fabric on Fretting Wear Performance of Polyetherimide Composite

Semicrystalline Polyimides for Advanced Composites