The 21 edited and peer-reviewed papers contained in this volume derive from the 8th International Symposium on Particles on Surfaces: Detection, Adhesion and Removal, held in Providence, RI, in June 2002. Topics covered include: the use of surfactants, rectangular jets, ultrasonics and megasonics, laser surface cleaning, and ice-air blast cleaning; characterization and identification of small particles; nanoscale adhesion of particles; SC-1 solutions and process parameters; and more.

From the Preface: “...In a world of shrinking dimensions and with the tremendous interest in various nanotechnologies, the need to understand the physics of nanoparticles becomes quite patent. With the interest in and concern with nanoparticles comes the need for new and more sensitive metrological and analysis techniques to detect, quantitate, analyse and chararacterize very small particles on a host of substrates...”

Target Audience: Scientists, technologists, and upper-level students concerned with the adhesion, detection, and removal of fine particles on surfaces.

Table of Contents:

Particle Analysis/Characterization and General Cleaning-Related Topics:

The Nature and Characterization of Small Particles

Surface and Micro-Analytical Methods for Particle Identification

The Haze of a Wafer: A New Approach to Monitor Nano-Sized Particles

Particle Transport and Adhesion in an Ultra-Clean Ion-Beam Sputter Deposition Process

Particle Deposition for a Carry-Over Layer During Immersion Rinsing

The Use of Surfactants to Reduce Particulate Contamination on Surfaces

The Use of Rectangular Jets for Surface Decontamination

Ice-Air Blast Cleaning: Case Studies

Development of a Technique for Glass Cleaning in the Course of Demanufacturing of Electronic Products

Particle Adhesion and Removal:

Mechanics of Nanoparticle Adhesion — A Continuum Approach

A New Thermodynamic Theory of Adhesion of Particles on Surfaces

Particle Adhesion on Nanoscale Rough Surfaces

Advanced Wet Cleaning of Sub-Micrometer Sized Particles

Modified SC-1 Solutions for Silicon Wafer Cleaning

Investigation of Ozonated DI Water in Semiconductor Wafer Cleaning

Possible Post-CMP Cleaning Processes for STI Ceria Slurries

The Ideal Ultrasonic Parameters for Delicate Parts Cleaning

Effects of Megasonics Coupled with SC-1 Process Parameters on Particle Removal on 300-mm Silicon Wafers

Influences of Various Parameters on Microparticles Removal During Laser Surface Cleaning

Particle Removal with Pulsed-Laser Induced Plasma Over an Extended Area of a Silicon Wafer

Particle Removal by Collisions with Energetic Clusters