|
This updated and revised second edition of
Principles of Plasma Discharges for Materials
Processing further extends the in-depth treatment of both basic plasma physics and industrial plasma processing
originally presented in the very well received first edition. Along with comprehensive coverage of plasma
fundamentals, the text also applies basic theory to plasma discharges, including calculations of
plasma parameters and the scaling of plasma parameters with control parameters. This edition includes
new chapters on dusty plasmas and the kinetic theory of discharges; it also covers recent developments
and further clarifies the presentation of basic principles.
From the Preface: “This book discusses the fundamental principles of partially ionized,
chemically reactive plasma discharges and their use in thin-film processing. Plasma processing is a
high-technology discipline born out of the need to access a parameter space in materials processing unattainable
by strictly chemical methods. The field is interdisciplinary, combining the areas of plasma physics,
surface science, gas-phase chemistry, and atomic and molecular physics. The common theme is the
creation and use of plasmas to activate a chain of chemical reactions at a substrate surface. Our treatment
is mainly restricted to discharges at low pressures, <1 Torr, which deliver activation energy, but
not heat, to the surface...”
Target Audience: Students and practicing professionals — across a broad spectrum of
technological disciplines — who are interested in plasma processing and materials modification.
Table of Contents:
Introduction
Basic Plasma Equations and Equilibrium
Atomic Collisions
Plasma Dynamics
Diffusion and Transport
Direct Current (DC) Sheaths
Chemical Reactions and Equilibrium
Molecular Collisions
Chemical Kinetics and Surface Processes
Particle and Energy Balance in Discharges
Capacitive Discharges
Inductive Discharges
Wave-Heated Discharges
Direct Current (DC) Discharges
Etching
Deposition and Implantation
Dusty Plasmas
Kinetic Theory of Discharges
Appendix A: Collision Dynamics
Appendix B: The Collision Integral
Appendix C: Diffusion Solutions for Variable Mobility Model
References
Index
|
