|
This volume is based on papers presented at the
Second International Symposium on Adhesion Aspects
of Thin Films (including Adhesion Measurement and Metallized
Plastics) held in Savannah, GA in November 2005. Some additional papers have been included to broaden the scope of the book. Topics
covered include the various factors generating and affecting stresses in thin films; the relevance of stresses
in adhesion; ways to improve adhesion; adhesion measurement; plastics metallization; plastic
surface treatments to improve adhesion of metal layers; and investigation of metal—plastic interfaces.
From the Preface: “...This volume and its predecessors reflect the latest R & D activity in this
highly technologically important arena. All signals indicate that the interest in this topic will be more
intensified in the future as more and new materials will be utilized in thin film form. Anyone with current
or anticipated need to understand the adhesion aspects of thin films will find this and the
previous volumes an excellent source of useful and valuable information...”
Target Audience: Researchers, technologists, and upper-level students concerned with the adhesion
of thin films and the metallization of plastics.
Table of Contents:
Stress and Adhesion Aspects of Thin Films:
Independent Control of Refractive Index and Internal Stress in Tantalum Oxide Films Deposited
by Pulsed and Inductively-Coupled-Plasma Assisted Pulsed Sputtering
Stress and Young's Modulus Properties of Some Metallic Thin Films
Poly(tetrafluoroethylene) Thin Films Deposited by Vacuum Evaporation and RF Sputtering
Adhesion Layer Effects on the Fabrication of MEMS-Based PZT Devices Deposited on
Silicon-Nitride-Coated Substrates
Fracture and Adhesion of Thin Films on Ductile Substrates
Composition Dependence of the Scratch Resistance of
CrNx Coatings on Steel
Adhesion Assessment of Ultra-Thin-Plasma-Polymerized Coatings on Stainless-Steel Stents Using
the Small-Punch Test
Practical Adhesion of Electroless Ni Thin Films on Polymer Surfaces. A Novel Approach
Combining Fragmentatoin Test with Electrical Resistance Measurements
Metallized Plastics:
Ni or Cu Electroless Metallization of Polymer Substrates Using Sn-Free or Pd-Free Processes
Surface Modification of Micropatterned Poly(tetrafluoroethylene) Films via Grafting of Viologen
for Electroless Metallizatoin
Development of Epoxy Polymer Surface Roughness Due to Wet Chemical Treatments and Its
Relevance to Adhesion of Electrochemically-Deposited Copper
Aspects of Amino Functionalization of Polypropylene Surfaces for Adhesion Promotion of
Thermally-Evaporated Copper Films
Plasma Surface Modification of Poly(oxybenzoate-co-oxynaphthoate) Films for Copper Metallization
Surface Treatment of Plastic Substrates for Improved Adhesion of Thin Metal Films through
Ion Bombardment by an Anode Layer Ion Source
Tailoring of Thermoplastic Polymer Surfaces with Low Energy Ions: Relevance to Growth and
Adhesion of Cu
Chemistry at the Cu—Fluoropolymer Interface: Relevance to Adhesion
|
